US 12,353,940 B2
Tamper-evident RFID tag and method thereof
Pierre Muller, Marin (CH); Yves Dupraz, Valeyres sous Montagny (CH); Alexis Durand, Cudrefin (CH); and Gordon Limond, Payerne (CH)
Assigned to EM MICROELECTRONIC-MARIN S.A., Marin (CH)
Filed by EM Microelectronic-Marin SA, Marin (CH)
Filed on Dec. 21, 2022, as Appl. No. 18/085,770.
Claims priority of application No. 21218213 (EP), filed on Dec. 29, 2021.
Prior Publication US 2023/0206022 A1, Jun. 29, 2023
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07798 (2013.01) 13 Claims
OG exemplary drawing
 
1. A method for manufacturing a tamper-evident RFID Tag, said method comprising:
providing a protection layer deposited on an integrated circuit that has a primary IC contact and a secondary IC contact;
curing said protection layer between 100° C. and 200° C. for between 2 minutes and 45 minutes such as to turn said protection layer into a degradable layer; and
providing a main electrical contact deposit comprising:
depositing a first electrical contact on said degradable layer, and
depositing a second electrical contact on said degradable layer,
wherein said first electrical contact comprises a first proximal electrical contact portion and a first distal electrical contact portion, and said second electrical contact comprises a second proximal electrical contact portion and a second distal electrical contact portion
wherein said depositing the first electrical contact on said degradable layer comprises:
configuring the first proximal contact portion to contact said primary IC contact, and
configuring said first distal electrical contact portion to be a predetermined
distance from said secondary IC contact, and wherein said depositing the second electrical contact on said degradable layer comprises:
configuring the second proximal contact portion to contact said secondary IC contact, and
configuring said second distal electrical contact portion to be a predetermined distance from said primary IC contact.