US 12,353,750 B2
Idle mode temperature control for memory systems
Francesco Basso, Portici (IT); Antonino Pollio, Vico Equense (IT); Francesco Falanga, Quarto (IT); and Massimo Iaculo, San Marco Evangelista (IT)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jun. 21, 2024, as Appl. No. 18/750,250.
Application 18/750,250 is a continuation of application No. 17/900,361, filed on Aug. 31, 2022, granted, now 12,039,189.
Prior Publication US 2024/0419353 A1, Dec. 19, 2024
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0653 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0652 (2013.01); G06F 3/0679 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory system comprising:
two or more memory devices, each of the two or more memory devices comprising a temperature sensor; and
one or more controllers coupled with the two or more memory devices and configured to cause the memory system to:
receive, at a first memory device of the two or more memory devices, a first timing indication of a duration between entering an idle mode and measuring a temperature of the first memory device via the temperature sensor of the first memory device;
enter the idle mode; and
perform a first quantity of one or more dummy access operations at the first memory device in accordance with the first timing indication and the temperature of the first memory device being lower than a threshold temperature of the first memory device.