US 12,353,719 B2
Thermal duplication of data
David Aaron Palmer, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 24, 2024, as Appl. No. 18/421,287.
Claims priority of provisional application 63/482,812, filed on Feb. 2, 2023.
Prior Publication US 2024/0264746 A1, Aug. 8, 2024
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0611 (2013.01) [G06F 3/0653 (2013.01); G06F 3/0679 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
one or more components configured to:
detect that data is to be associated with thermal duplication;
write multiple copies of the data based on detecting that the data is to be associated with the thermal duplication,
wherein the multiple copies of the data are associated with respective temperature profiles, and
wherein the multiple copies are written at temperatures of the memory device that correspond to the respective temperature profiles;
receive, from a host device, a read request associated with the data;
detect a current temperature of the memory device based on receiving the read request; and
read a copy, from the multiple copies, that is associated with a temperature profile that corresponds to the current temperature of the memory device.