US 12,353,130 B2
Photosensitive resin composition and photosensitive resin multilayer body
Tonami Tajiri, Tokyo (JP); Junya Kosaka, Tokyo (JP); Teruhisa Yamada, Tokyo (JP); and Shinichi Kunimatsu, Tokyo (JP)
Assigned to ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 17/775,829
Filed by ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Nov. 11, 2020, PCT No. PCT/JP2020/042140
§ 371(c)(1), (2) Date May 10, 2022,
PCT Pub. No. WO2021/095784, PCT Pub. Date May 20, 2021.
Claims priority of application No. 2019-204176 (JP), filed on Nov. 11, 2019; and application No. 2020-071836 (JP), filed on Apr. 13, 2020.
Prior Publication US 2022/0390843 A1, Dec. 8, 2022
Int. Cl. G03F 7/033 (2006.01); G03F 7/029 (2006.01); H01L 23/00 (2006.01)
CPC G03F 7/033 (2013.01) [G03F 7/029 (2013.01); H01L 24/11 (2013.01); H01L 2224/1146 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A photosensitive resin multilayer film comprising a support film and a photosensitive resin layer comprising a photosensitive resin composition comprising:
(A) an alkali-soluble polymer: 10% by weight to 90% by weight,
(B) a compound having an ethylenically unsaturated double bond: 5% by weight to 70% by weight, and
(C) a photopolymerization initiator: 0.01% by weight to 20% by weight, the photosensitive resin layer being laminated on the support film, wherein
the alkali-soluble polymer (A) comprises a copolymer comprising a (meth)acrylate which has an alkyl group having 3 to 12 carbon atoms as a copolymerization component,
an acrylate monomer is contained as the compound having an ethylenically unsaturated double bond (B) in an amount of 51% by weight to 100% by weight based on the total amount of the compound having an ethylenically unsaturated double bond (B),
a relationship represented by the following inequality (I) is satisfied:
0<A/T≤0.007  Inequality (I)
where T (μm) is a thickness of the photosensitive resin layer comprising the photosensitive resin composition, and A is an absorbance at a wavelength of 365 nm,
the thickness of the photosensitive resin layer comprising the photosensitive resin composition is 40 μm or more and 600 μm or less, and
the photosensitive resin multilayer film comprises, as the photopolymerization initiator (C), an imidazole compound.