| CPC G03F 7/0002 (2013.01) | 13 Claims |
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1. An imprint apparatus for performing an imprint process of forming a pattern of an imprint material in a plurality of shot regions on a substrate using a mold, comprising:
a supply unit configured to supply a gas between the mold and the substrate; and
a control unit configured to control an operation of continuously performing the imprint process for the plurality of shot regions on the substrate to which an uncured imprint material is supplied while driving the substrate with respect to the mold,
wherein the control unit
controls performing a first operation of, while driving the substrate such that a target shot region in the plurality of shot regions, for which the imprint process should be performed, is located at a first position facing the mold, supplying the gas from the supply unit,
determines whether to perform a second operation including an operation of additionally supplying the gas after the first operation based on at least one of information regarding a delay or a stop in continuous imprint process for the plurality of shot regions, information regarding a timing of starting supply of the gas in the first operation, information regarding a time needed to release the mold from the cured imprint material on a previous shot region where a previous imprint process is performed before the imprint process for the target shot region, and information regarding skipping the imprint process for the target shot region, and
controls performing the second operation when it is determined to perform the second operation, and
wherein
in the first operation, supply of the gas from the supply unit is started before the target shot region is located at the first position, and supply of the gas from the supply unit is stopped after the target shot region is located at the first position and before the mold and the imprint material on the target shot region are brought into contact with each other, and
in the second operation, the substrate is driven such that the target shot region is located at a second position different from the first position, and supply of the gas from the supply unit is resumed while driving the substrate such that the target shot region located at the second position is located at the first position.
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