US 12,353,099 B2
Display device
Hirokazu Seki, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on May 14, 2024, as Appl. No. 18/663,715.
Application 17/549,119 is a division of application No. 16/832,740, filed on Mar. 27, 2020, granted, now 11,227,909, issued on Jan. 18, 2022.
Application 16/832,740 is a division of application No. 16/161,619, filed on Oct. 16, 2018, granted, now 10,644,095, issued on May 5, 2020.
Application 18/663,715 is a continuation of application No. 18/221,525, filed on Jul. 13, 2023, granted, now 12,022,705.
Application 18/221,525 is a continuation of application No. 17/549,119, filed on Dec. 13, 2021, granted, now 11,751,452, issued on Sep. 5, 2023.
Claims priority of application No. 2017-203819 (JP), filed on Oct. 20, 2017.
Prior Publication US 2024/0298489 A1, Sep. 5, 2024
Int. Cl. H10K 59/13 (2023.01); G02F 1/1345 (2006.01); G06F 3/044 (2006.01); G06F 3/047 (2006.01); H10K 50/81 (2023.01); H10K 50/82 (2023.01); H10K 50/84 (2023.01); H10K 50/842 (2023.01); H10K 50/844 (2023.01); H10K 50/86 (2023.01); H10K 59/131 (2023.01); H10K 59/40 (2023.01); H10K 59/80 (2023.01); G02F 1/1362 (2006.01); G09G 3/3266 (2016.01); H10K 50/856 (2023.01)
CPC G02F 1/13452 (2013.01) [G06F 3/0446 (2019.05); G06F 3/047 (2013.01); H10K 50/81 (2023.02); H10K 50/82 (2023.02); H10K 50/84 (2023.02); H10K 50/8426 (2023.02); H10K 50/844 (2023.02); H10K 50/86 (2023.02); H10K 59/131 (2023.02); H10K 59/40 (2023.02); H10K 59/87 (2023.02); G02F 1/136286 (2013.01); G09G 3/3266 (2013.01); H10K 50/8445 (2023.02); H10K 50/856 (2023.02); H10K 59/8051 (2023.02); H10K 59/8052 (2023.02); H10K 59/8731 (2023.02); H10K 59/878 (2023.02); H10K 59/8791 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A display device comprising:
a first substrate;
a second substrate opposing the first substrate;
a wiring substrate connected to the first substrate;
a cover member located on an opposite side to the first substrate so as to interpose the second substrate therebetween in cross-section; and
a conductive layer,
the first substrate comprising an extension portion extending further from the second substrate,
the wiring substrate being connected to the extension portion,
the cover member comprising a first surface opposing the extension portion,
the conductive layer being connected to the first surface of the cover member, overlapping the extension portion and the wiring substrate in plan view,
the wiring substrate further comprises a reference potential member, and
the conductive layer is in contact with the reference potential member.