| CPC G02F 1/035 (2013.01) [G02F 2202/20 (2013.01)] | 15 Claims |

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1. An electro-optic system, comprising:
a plurality of photonic dies;
a glass interposer coupled to the plurality of photonic dies; and
an electro-optic switch integrated with the glass interposer and coupled between two or more of the plurality of photonic dies, wherein:
a photonic die of the plurality of photonic dies is paired with a semiconductor die in a chip sub-assembly; and
the photonic die and the semiconductor die are coupled together by a bridge die located beneath both the photonic die and the semiconductor die.
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