US 12,353,034 B2
Optical integrated circuit structure including edge coupling protective features and method of forming same
Chen-Hao Huang, Taoyuan (TW); Sui-Ying Hsu, New Taipei (TW); YuehYing Lee, Hsinchu (TW); Chia-Ping Lai, Hsinchu (TW); Chien-Ying Wu, Hsinchu (TW); and Hau-Yan Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Feb. 27, 2024, as Appl. No. 18/589,180.
Application 18/589,180 is a continuation of application No. 17/460,789, filed on Aug. 30, 2021, granted, now 11,940,659.
Prior Publication US 2024/0201458 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/136 (2006.01); G02B 6/30 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/58 (2006.01)
CPC G02B 6/4248 (2013.01) [G02B 6/12 (2013.01); G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/136 (2013.01); G02B 6/4206 (2013.01); G02B 6/4274 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); G02B 6/30 (2013.01); G02B 6/4228 (2013.01); G02B 6/4236 (2013.01); H01L 21/30604 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 23/585 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical integrated circuit (IC) structure comprising:
a substrate comprising a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot;
a bottom oxide layer disposed on the substrate;
a semiconductor layer disposed on the bottom oxide layer;
vents that extend through the semiconductor layer and the bottom oxide layer to expose the undercut; and
a barrier layer disposed on surfaces of the vents, the undercut, and the fiber slot.