US 12,353,015 B2
Optical package device and method of manufacturing the same
Ying-Chung Chen, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Feb. 3, 2023, as Appl. No. 18/105,705.
Prior Publication US 2024/0264377 A1, Aug. 8, 2024
Int. Cl. G02B 6/293 (2006.01)
CPC G02B 6/29301 (2013.01) 20 Claims
OG exemplary drawing
 
1. An optical package device, comprising:
an optical component, configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state;
an optical guiding component disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component; and
a lid in contact with the optical guiding component,
wherein a physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.