US 12,353,008 B2
Package, optical device, and manufacturing method of package
Hsien-Wei Chen, Hsinchu (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 19, 2023, as Appl. No. 18/354,662.
Application 18/354,662 is a continuation of application No. 17/751,666, filed on May 24, 2022, granted, now 11,789,201.
Application 17/751,666 is a continuation of application No. 17/076,795, filed on Oct. 21, 2020, granted, now 11,372,160, issued on Jun. 28, 2022.
Claims priority of provisional application 62/968,161, filed on Jan. 31, 2020.
Prior Publication US 2023/0358956 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/42 (2006.01); G02B 6/122 (2006.01); G02B 6/12 (2006.01)
CPC G02B 6/1225 (2013.01) [G02B 6/4239 (2013.01); G02B 6/4283 (2013.01); G02B 2006/1213 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a photonic integrated circuit die, comprising:
a substrate having a notch, wherein the notch is occupied by air, and the notch extends from an interior of the substrate to an end edge of the substrate; and
a waveguide disposed over the substrate and outside of the notch, wherein in a top view, a first portion of the waveguide is overlapped with the substrate and a second portion of the waveguide is overlapped with the notch; and
an electric integrated circuit die disposed over the photonic integrated circuit die.