US 12,352,868 B1
Systems and methods of LIDAR sensor systems having integrated semiconductor devices
James Ferrara, Oakland, CA (US); Pruthvi Jujjavarapu, Palo Alto, CA (US); Yongxuan Edward Liang, Fremont, CA (US); Sen Lin, Mountain View, CA (US); and Zhizhong Tang, Palo Alto, CA (US)
Assigned to AURORA OPERATIONS, INC., Pittsburgh, PA (US)
Filed by Aurora Operations, Inc., Mountain View, CA (US)
Filed on Feb. 13, 2023, as Appl. No. 18/109,125.
Int. Cl. H01L 25/16 (2023.01); B60W 10/18 (2012.01); B60W 10/20 (2006.01); B60W 60/00 (2020.01); G01S 7/481 (2006.01); G01S 17/58 (2006.01); G01S 17/931 (2020.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01)
CPC G01S 17/931 (2020.01) [B60W 10/18 (2013.01); B60W 10/20 (2013.01); B60W 60/001 (2020.02); G01S 7/4817 (2013.01); G01S 17/58 (2013.01); H01L 23/481 (2013.01); H01L 25/167 (2013.01); B60W 2420/408 (2024.01); B60W 2554/4042 (2020.02); B60W 2554/802 (2020.02); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73257 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A light detection and ranging (LIDAR) sensor system for a vehicle, comprising:
a circuit module, comprising:
a silicon substrate having a first coefficient of thermal expansion (CTE) and a first surface opposite a second surface;
a III-V semiconductor substrate having a third surface opposite a fourth surface, the third surface facing the first surface and coupled to the silicon substrate, the III-V semiconductor substrate having a second CTE;
an optical device coupled to the III-V semiconductor substrate, the optical device configured to output a transmit beam;
a plurality of first vias disposed in a particular portion of the silicon substrate that is under the III-V semiconductor substrate, the plurality of first vias extending in the silicon substrate between the first surface and the second surface and towards the third surface, wherein, at least one via of the plurality of first vias has a third CTE; and
a plurality of second vias each directly coupling a first one of the plurality of first vias to the third surface; and
a scanner configured to direct the transmit beam to an environment of the vehicle.