US 12,352,804 B1
Additively manufactured printed electronics tester
Daniel Benjamin Hartley, Holden, MO (US); Jaime Eduardo Regis, Overland Park, KS (US); Ryan John Eickbush, Lee+3 s Summit, MO (US); Bill Capen, Raymore, MO (US); and Jason Bradley Edgar, Potosi, MO (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed by Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed on Jul. 29, 2024, as Appl. No. 18/787,537.
Int. Cl. B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); G01R 31/28 (2006.01); H05K 1/02 (2006.01)
CPC G01R 31/2818 (2013.01) [B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/0268 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A testing platform comprising:
an electrical device configured to maintain an electrical connection with an additional electrical device when the electrical device and the additional electrical device are assembled together, the electrical device comprising:
one or more leads forming a leaded area on the electrical device;
one or more connection pads located on a surface of the electrical device, the one or more connection pads establishing a secondary electrical connection between the electrical device and an external testing system; and
a testing pattern deposited on the leaded area of the electrical device, the testing pattern usable by the external testing system for testing the electrical device, the testing pattern comprising:
one or more printed traces, the one or more printed traces formed from a material deposited via an additive manufacturing technique,
wherein the one or more printed traces are located between the electrical device and the additional electrical device when the electrical device and the additional electrical device are assembled together.