US 12,352,803 B2
Device for and method of frequency testing printed circuit board under thermal stress
Mark Ryan Northrup, Marana, AZ (US); Andrew Ryan Rodack, Tucson, AZ (US); Matthew E. Riley, Tucson, AZ (US); and Maxwell John Hamilton, Marana, AZ (US)
Assigned to Raytheon Company, Arlington, VA (US)
Filed by Raytheon Company, Arlington, VA (US)
Filed on Aug. 25, 2023, as Appl. No. 18/456,010.
Prior Publication US 2025/0067792 A1, Feb. 27, 2025
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2817 (2013.01) 20 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) test system, comprising:
a temperature chamber comprising;
at least one slot to accommodate at least one PCB test coupon;
an input bus connected to inputs of the at least one slot; and
an output bus connected to outputs of the at least one slot, wherein the temperature chamber is configured to apply a temperature to the at least one PCB test coupon;
a signal generator comprising an output bus connected to the input bus of the at least one slot;
a frequency meter comprising an input bus connected to the output bus of the at least one slot and an output bus; and
a comparator connected to the output bus of the signal generator and the output bus of the frequency meter for comparing corresponding outputs of the signal generator and the frequency meter and determining acceptability of at least one PCB fabricated with, and separated from, the at least one PCB test coupon.