US 12,352,782 B2
Semiconductor testing socket
Long Zhang, Jiangsu (CN); Chunli Zhuo, Jiangsu (CN); and Jinrong Chen, Jiangsu (CN)
Assigned to Antares Advanced Test Technologies (Suzhou) Limited, Jiangsu (CN)
Appl. No. 18/260,548
Filed by Antares Advanced Test Technologies (Suzhou) Limited, Jiangsu (CN)
PCT Filed Jan. 6, 2022, PCT No. PCT/CN2022/070490
§ 371(c)(1), (2) Date Jul. 6, 2023,
PCT Pub. No. WO2022/148395, PCT Pub. Date Jul. 14, 2022.
Claims priority of application No. 202110013375.1 (CN), filed on Jan. 6, 2021.
Prior Publication US 2024/0302408 A1, Sep. 12, 2024
Int. Cl. G01R 1/04 (2006.01); G01R 1/02 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/00 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01)
CPC G01R 1/0466 (2013.01) 15 Claims
OG exemplary drawing
 
1. A semiconductor testing socket, comprising:
a testing socket body;
a guiding frame; and
a height adjusting mechanism;
wherein the guiding frame is mounted above the testing socket body and is provided with a central insertion opening;
wherein the height adjusting mechanism is embedded at edges of the central insertion opening;
wherein the height adjusting mechanism comprises an operable part that can be operated and a movable part that can be moved between a first position located outside the central insertion opening and a second position located within the central insertion opening by operating the operable part; and
wherein the movable part comprises a supporting surface configured for supporting a specimen to be tested when it is located at the second position.