US 12,352,781 B2
Test kit for testing a device under test
Jing-Hui Zhuang, Hsinchu (TW); Ying-Chou Shih, Hsinchu (TW); Sheng-Wei Lei, Hsinchu (TW); Chang-Lin Wei, Hsinchu (TW); Che-Hsien Huang, Hsinchu (TW); Shih-Chia Chiu, Hsinchu (TW); Yi-Chieh Lin, Hsinchu (TW); and Wun-Jian Lin, Hsinchu (TW)
Assigned to MEDIATEK INC., Hsinchu (TW)
Filed by MEDIATEK INC., Hsin-Chu (TW)
Filed on Mar. 30, 2023, as Appl. No. 18/129,040.
Application 18/129,040 is a continuation in part of application No. 17/735,130, filed on May 3, 2022, granted, now 11,879,934.
Claims priority of provisional application 63/209,451, filed on Jun. 11, 2021.
Claims priority of provisional application 63/380,592, filed on Oct. 24, 2022.
Prior Publication US 2023/0236222 A1, Jul. 27, 2023
Int. Cl. G01R 1/04 (2006.01)
CPC G01R 1/0466 (2013.01) 16 Claims
OG exemplary drawing
 
1. A test kit for testing a device under test (DUT), comprising:
a socket structure, for containing the DUT; and
a plunger assembly detachably coupled with the socket structure, wherein the plunger assembly comprises a multi-layered structure comprising a nest and at least an interposer substrate installed under the nest, wherein the socket structure comprises a socket housing and an annular socket base secured to an upper surface of an annular perimeter structure of the socket housing, wherein the annular socket base surrounds perimeter of the interposer substrate.