US 12,352,674 B2
Test method and method for manufacturing semiconductor device
Hidetoshi Ishibashi, Tokyo (JP); Ayumi Minamide, Tokyo (JP); Seiji Oka, Tokyo (JP); Yurie Furuta, Tokyo (JP); and Shunji Masumori, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Nov. 23, 2022, as Appl. No. 18/058,623.
Claims priority of application No. 2022-005047 (JP), filed on Jan. 17, 2022.
Prior Publication US 2023/0228661 A1, Jul. 20, 2023
Int. Cl. G01N 11/02 (2006.01)
CPC G01N 11/02 (2013.01) 10 Claims
OG exemplary drawing
 
1. A test method for determining pumping-out performance of a thermal grease, comprising:
applying the thermal grease on a support plate;
observing a shape of the thermal grease a first time;
placing a plate such that the plate faces the support plate with the thermal grease interposed between the plate and the support plate;
after observing the shape of the thermal grease the first time, changing a distance to at least increase the distance between the support plate and the plate;
observing a shape of the thermal grease a second time after the distance is changed while the plate is at the changed distance from the support plate, the changed distance being different from a distance between the plate and the support plate before the changing the distance, and
determining pumping-out performance of the thermal grease based on a change in the shape of the thermal grease between the shape observed at the first time and the shape observed at the second time.