US 12,352,645 B2
Semiconductor device and electronic apparatus with O-ring reinforcement structure
Yoshihiro Yoshida, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 20, 2023, as Appl. No. 18/136,952.
Application 18/136,952 is a continuation of application No. PCT/JP2021/033359, filed on Sep. 10, 2021.
Claims priority of application No. 2020-190317 (JP), filed on Nov. 16, 2020.
Prior Publication US 2023/0296463 A1, Sep. 21, 2023
Int. Cl. G01L 9/00 (2006.01); G01L 19/00 (2006.01)
CPC G01L 19/0038 (2013.01) [G01L 9/0041 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device which detects pressure, the semiconductor device comprising:
a base substrate;
a detector mounted on an upper surface of the base substrate and including a pressure detector to detect pressure;
a resin package provided on the upper surface of the base substrate, with the detector buried therein, and including a cavity which exposes the pressure detector upward;
a lid supported by the resin package so as to close the cavity; and
a communicating portion to cause the cavity to communicate with outside of the semiconductor device; wherein the resin package includes:
a base portion where the detector is buried; and
a protruding portion protruding upward from the base portion and including the cavity;
in plan view, the base portion extends outward from an outer side surface of the protruding portion;
the lid is supported by an upper surface of the protruding portion;
the lid includes an extending portion in at least a portion of an outer circumferential portion of the lid, the extending portion extending outward from the outer side surface of the protruding portion in plan view; and
the communicating portion is open sideward of the semiconductor device to communicate with outside.