US 12,352,639 B2
Cutting force measurement system
Masahiro Uekita, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Dec. 9, 2022, as Appl. No. 18/063,903.
Claims priority of application No. 2022-017888 (JP), filed on Feb. 8, 2022.
Prior Publication US 2023/0251145 A1, Aug. 10, 2023
Int. Cl. G01L 1/16 (2006.01); G01L 5/00 (2006.01)
CPC G01L 1/16 (2013.01) [G01L 5/0061 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A sensor unit of a machining device comprising:
a piezoelectric sensor having a wire shape;
a measurement part including an abutting surface formed with a guide groove that holds a part of the piezoelectric sensor and abutting a measurement object at predetermined pressure; and
a cushioning holding part that holds, in a buffered state, another part of the piezoelectric sensor located outside the abutting surfaces.