US 12,352,602 B2
Optical module and method of making the same
Ying-Chung Chen, Kaohsiung (TW); Hsun-Wei Chan, Kaohsiung (TW); Lu-Ming Lai, Kaohsiung (TW); and Kuang-Hsiung Chen, Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 5, 2023, as Appl. No. 18/530,130.
Application 18/530,130 is a continuation of application No. 17/684,374, filed on Mar. 1, 2022, granted, now 11,835,363.
Application 17/684,374 is a continuation of application No. 16/683,117, filed on Nov. 13, 2019, granted, now 11,262,197, issued on Mar. 1, 2022.
Application 16/683,117 is a continuation of application No. 14/975,083, filed on Dec. 18, 2015, granted, now 10,508,910, issued on Dec. 17, 2019.
Claims priority of application No. 201410802251.1 (CN), filed on Dec. 22, 2014.
Prior Publication US 2024/0102799 A1, Mar. 28, 2024
Int. Cl. G01C 3/08 (2006.01)
CPC G01C 3/08 (2013.01) 13 Claims
OG exemplary drawing
 
1. An optical module,
comprising: a carrier;
an emitting component disposed over the carrier;
a receiving component disposed over the carrier;
a housing accommodating the emitting component and the receiving component;
a first adhesive at least partially disposed between the housing and the carrier, wherein the first adhesive extends from a lateral surface of the emitting component to a lateral surface of the receiving component.