US 12,351,932 B2
Plating process method
Yasuyuki Masuda, Tokyo (JP); and Masaki Tomita, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/910,977
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Oct. 18, 2021, PCT No. PCT/JP2021/038403
§ 371(c)(1), (2) Date Sep. 12, 2022,
PCT Pub. No. WO2023/067649, PCT Pub. Date Apr. 27, 2023.
Prior Publication US 2024/0209540 A1, Jun. 27, 2024
Int. Cl. C25D 21/04 (2006.01); C25D 17/00 (2006.01)
CPC C25D 21/04 (2013.01) [C25D 17/002 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A plating method for electroplating a metal on a substrate, the plating method comprising:
a step of supplying an anode liquid to a first region in an anode chamber separated from a cathode chamber by a membrane and including an anode and suppressing a nonionic plating additive passing through the membrane while permitting ion species containing metallic ions passing through the membrane;
a step of guiding a part of the anode liquid supplied to the first region to a second region positioned below the membrane and above the first region to decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region, the second region being a region below the membrane and above a second membrane disposed below the membrane, the first region being a region below the second membrane, and a lower surface of the second membrane has an inclined site inclined with respect to a horizontal direction;
a step of discharging the anode liquid from the first region;
a step of discharging the anode liquid from the second region;
a step of supplying a cathode liquid to the cathode chamber in which the substrate is disposed; and
a step of flowing electricity between the substrate and the anode to electroplate the metal on the substrate.