US 12,351,930 B2
Electroplating device and method for manufacturing plated product
Masayuki Iimori, Tokyo (JP); and Ryosuke Takeda, Tokyo (JP)
Assigned to YKK Corporation, Tokyo (JP)
Appl. No. 17/780,006
Filed by YKK Corporation, Tokyo (JP)
PCT Filed Dec. 24, 2019, PCT No. PCT/JP2019/050716
§ 371(c)(1), (2) Date May 25, 2022,
PCT Pub. No. WO2021/130874, PCT Pub. Date Jul. 1, 2021.
Prior Publication US 2022/0411951 A1, Dec. 29, 2022
Int. Cl. C25D 21/10 (2006.01); C25D 17/02 (2006.01)
CPC C25D 17/02 (2013.01) [C25D 21/10 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of producing electroplated objects, the method comprising:
electroplating to-be-electroplated objects in an electroplating tank that stores an electrolyte solution in which at least the objects and magnetic media have sunken;
rotating a magnetic rotator under the electroplating tank so as to move the magnetic media in the electrolyte solution in accordance with magnetic attraction and magnetic repulsion, an internal space of the electroplating tank being sectioned into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space; and
transferring the magnetic rotator in a lateral direction intersecting a rotational axis of the magnetic rotator such that the objects are shifted between a condition of being present in the electrolyte solution and in the first space where polishing is dominant over electroplating and a condition of being present in the electrolyte solution and in the second space where electroplating is dominant over polishing,
wherein each of the objects is shifted between a condition of being electroplated at a first rate in the electrolyte solution and in the first space and a condition of being electroplated at a second rate in the electrolyte solution and in the second space, the second rate being greater than the first rate.