| CPC C23C 16/4401 (2013.01) [G01N 25/20 (2013.01); G06Q 10/04 (2013.01); G06Q 50/04 (2013.01)] | 19 Claims |

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1. A method for monitoring a surface condition of a component, the method comprising:
providing, by a heater, thermal energy to the component, wherein the component is used in a semiconductor processing system that manufactures semiconductors;
varying, by a controller, at least one of an intensity and a duration of the thermal energy to create a thermal signature of the component, wherein the controller comprises one or more processors configured to execute instructions stored in a nontransitory computer-readable medium;
determining, by a controller in communication with the heater, a thermal response of the heater in response to providing the thermal energy, wherein the thermal response includes a parameter of the heater, wherein the thermal signature is an image representation of the thermal response;
determining, by the controller, a thermal characteristic of the component based on a reference thermal response and the thermal response; and
predicting, by the controller, the surface condition of the component based on the thermal characteristic and a predictive analytic model, wherein the predictive analytic model correlates the thermal characteristics of the component to an estimated surface condition of the component.
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