US 12,351,753 B2
Composite material and composite material manufacturing method
Ryota Matsugi, Osaka (JP); Isao Iwayama, Osaka (JP); and Tetsuya Kuwabara, Osaka (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 16/970,427
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Feb. 18, 2019, PCT No. PCT/JP2019/005901
§ 371(c)(1), (2) Date Aug. 17, 2020,
PCT Pub. No. WO2019/163721, PCT Pub. Date Aug. 29, 2019.
Claims priority of application No. 2018-029077 (JP), filed on Feb. 21, 2018.
Prior Publication US 2020/0370146 A1, Nov. 26, 2020
Int. Cl. C09K 5/14 (2006.01); B22F 1/18 (2022.01); B22F 3/26 (2006.01); C09C 1/44 (2006.01); C22C 1/05 (2023.01); C22C 1/10 (2023.01); C22C 26/00 (2006.01); H01L 23/373 (2006.01)
CPC C09K 5/14 (2013.01) [B22F 1/18 (2022.01); B22F 3/26 (2013.01); C09C 1/44 (2013.01); C22C 1/05 (2013.01); C22C 1/10 (2013.01); C22C 26/00 (2013.01); C01P 2004/02 (2013.01); C01P 2004/61 (2013.01); C01P 2004/80 (2013.01); C01P 2006/32 (2013.01); H01L 23/373 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A composite material manufacturing method comprising:
a step of forming a laminated body by laminating a first layer and a second layer; and
a step of heating the laminated body, wherein
the first layer including:
a first powder made of a carbon-based substance; and
a second powder made of at least one of a compound containing at least one element selected from the group consisting of Si, Ti, Zr, and Hf, and an element itself selected from the group consisting of Si and Hf, wherein the first layer is formed by mixing the first powder and the second powder, and wherein when second powder is made of the compound containing the at least one element selected from the group consisting of Ti and Zr, the compound containing the at least one element selected from the group consisting of Ti and Zr is a sulfide, a nitride, a hydride, or a boride,
the second layer including:
a copper material consisting of Cu and inevitable impurities; and
the second powder,
in the heating step, the copper material being heated to a molten state under a vacuum atmosphere of 1 Pa or less, a reducing atmosphere or an inert atmosphere without pressurization, and compounded with the first powder,
wherein first layer containing the first powder and the second powder, and the second layer containing the copper material and the second powder are sequentially filled in a molding die.