US 12,351,737 B2
Chemical mechanical polishing of substrates containing copper and ruthenium
Haci Osman Guevenc, Ludwigshafen am Rhein (DE); Michael Lauter, Ludwigshafen am Rhein (DE); Te Yu Wei, Taoyuan (TW); Wei Lan Chiu, Taipei (TW); Reza M. Golzarian, Portland, OR (US); Julian Proelss, Allschwil (CH); and Leonardus Leunissen, Veldhoven (NL)
Assigned to BASF SE, Ludwigshafen am Rhein (DE)
Filed by BASF SE, Ludwigshafen am Rhein (DE)
Filed on Sep. 14, 2023, as Appl. No. 18/368,032.
Application 18/368,032 is a division of application No. 17/312,797, abandoned, previously published as PCT/EP2019/084771, filed on Dec. 12, 2019.
Claims priority of application No. 18212027 (EP), filed on Dec. 12, 2018.
Prior Publication US 2023/0416570 A1, Dec. 28, 2023
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1463 (2013.01); H01L 21/3212 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate in the presence of a chemical-mechanical polishing (CMP) composition comprising
(A) at least one inorganic abrasive particle;
(B) at least one chelating agent selected from carboxylic acids;
(C) at least one corrosion inhibitor selected from unsubstituted or substituted triazoles;
(D) at least one non-ionic surfactant comprising at least one polyoxyalkylene group;
(E) at least one pad-cleaning agent selected from polymers and co-polymers of acrylic acid, methacrylic acid and maleic acid; wherein the polymers and co-polymers of acrylic acid, methacrylic acid, and maleic acid have a number average molecular weight in the range of ≥500 g/mol to ≤3000 g/mol and wherein the at least one pad-cleaning agent is selected from poly (acrylic acid-co-maleic acid) copolymers;
(F) at least one carbonate or hydrogen carbonate;
(G) at least one oxidizing agent selected from the group consisting of organic peroxides, inorganic peroxides, persulfates, iodates, periodic acids, periodates, permanganates, perchloric acids, perchlorates, bromic acids and bromates; and
(H) an aqueous medium.