US 12,351,698 B2
Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
Toshihiro Hosoi, Ageo (JP); Kenshiro Fukuda, Ageo (JP); Yoshihiro Yoneda, Ageo (JP); Tomohiro Ishino, Ageo (JP); and Tetsuro Sato, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 17/442,339
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Feb. 7, 2020, PCT No. PCT/JP2020/004882
§ 371(c)(1), (2) Date Sep. 23, 2021,
PCT Pub. No. WO2020/195236, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-059816 (JP), filed on Mar. 27, 2019.
Prior Publication US 2022/0162418 A1, May 26, 2022
Int. Cl. C08K 3/22 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C08L 63/00 (2006.01); H01G 4/14 (2006.01)
CPC C08K 3/22 (2013.01) [B32B 15/043 (2013.01); B32B 15/20 (2013.01); C08L 63/00 (2013.01); H01G 4/14 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); B32B 2457/16 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2237 (2013.01); C08L 2203/20 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A resin composition comprising:
a binder component consisting of:
bisphenol S blended in the resin composition as an unreacted monomer,
an epoxy resin curing agent having a phenolic hydroxyl group,
optionally, a polymer component, and
an epoxy resin; and
a dielectric filler;
wherein
the polymer component content is 0 parts by weight or more and 15 parts by weight or less based on 100 parts by weight of the binder component, and
the polymer component is selected from the group consisting of polyimide resins, polyamide resins, and polyamide-imide resins.