	US 12,351,686 B2
	Curable resin composition, dry film and cured product of same, and electronic component containing said cured product
Yoko Shibasaki, Hiki-gun (JP); and Chihiro Funakoshi, Hiki-gun (JP)
Assigned to TAIYO HOLDINGS CO., LTD., Hiki-gun (JP)
Appl. No. 17/640,180
Filed by TAIYO HOLDINGS CO., LTD., Saitama (JP)
PCT Filed Sep. 2, 2020, PCT No. PCT/JP2020/033228 § 371(c)(1), (2) Date Mar. 3, 2022, PCT Pub. No. WO2021/045085, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-162834 (JP), filed on Sep. 6, 2019.
Prior Publication US 2022/0325047 A1, Oct. 13, 2022
Int. Cl. C08G 73/14 (2006.01); C08G 18/34 (2006.01); C08G 18/79 (2006.01); C08G 59/20 (2006.01); C08K 3/30 (2006.01); C08K 3/36 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01)

CPC C08G 73/14 (2013.01) [C08K 3/30 (2013.01); C08K 3/36 (2013.01); C08L 79/08 (2013.01); C08G 18/34 (2013.01); C08G 18/79 (2013.01); C08G 59/20 (2013.01); C08K 2003/3045 (2013.01); C08L 63/00 (2013.01)]

20 Claims

1. A curable resin composition, comprising:

an amide-imide resin;

a thermosetting resin;

a thermosetting accelerator;

inorganic particles; and

a carboxyl group-containing resin having no amide-imide structures, wherein the amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 900, and the thermosetting resin is a thermosetting resin selected from the group consisting of an epoxy compound having a biphenyl skeleton, an epoxy compound having a dicyclopentadienyl skeleton and a mixture thereof.