US 12,351,684 B2
Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board
Yoshinori Sato, Niigata (JP); Hiroyuki Matsuyama, Niigata (JP); and Yoshihiko Konno, Niigata (JP)
Assigned to Arisawa MFG. Co., Ltd., (JP)
Filed by Arisawa MFG. Co., Ltd., Niigata (JP)
Filed on Apr. 3, 2024, as Appl. No. 18/626,296.
Application 18/626,296 is a division of application No. 18/031,734, previously published as PCT/JP2021/036515, filed on Oct. 1, 2021.
Claims priority of application No. 2020-177202 (JP), filed on Oct. 22, 2020.
Prior Publication US 2024/0270907 A1, Aug. 15, 2024
Int. Cl. C08G 73/10 (2006.01); H05K 1/03 (2006.01)
CPC C08G 73/10 (2013.01) [H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01)] 3 Claims
 
1. A metal-clad laminated board to be formed by laminating a polyimide resin layer including a polyimide resin on a rough surface or glossy surface of a metal foil, wherein
the polyimide resin is formed by curing a polyimide resin precursor;
wherein the polyimide resin precursor is obtained by allowing a diamine and an acid anhydride to react with each other, wherein
the diamine comprises p-phenylenediamine, a bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazol-5-amine,
the acid anhydride comprises a biphenyl tetracarboxylic dianhydride,
a content of the p-phenylenediamine is 30% to 75% by mol, a content of the bis(aminophenoxy)benzene is 10% to 30% by mol, and a content of the 2-(4-aminophenyl)benzoxazol-5-amine is 10% to 50% by mol, with respect to a total of the diamine, and
a content of the biphenyl tetracarboxylic dianhydride is 78% by mol or more with respect to a total of the acid anhydride; and
wherein a surface roughness (Sa) of the rough surface or glossy surface of the metal foil, on which the polyimide resin layer is laminated, is 0.09 μm to 0.18 μm.