US 12,351,413 B2
Post-processing device
Hiroyuki Kosuge, Matsumoto (JP); Chiaki Shimada, Shiojiri (JP); Kenji Uchibori, Shiojiri (JP); Naoki Uemura, Suwa (JP); Shun Hara, Matsumoto (JP); Hirohisa Kodaira, Shiojiri (JP); and Riku Maeda, Shiojiri (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on May 23, 2022, as Appl. No. 17/664,457.
Claims priority of application No. 2021-088151 (JP), filed on May 26, 2021.
Prior Publication US 2022/0380162 A1, Dec. 1, 2022
Int. Cl. B65H 31/02 (2006.01); B65H 31/36 (2006.01)
CPC B65H 31/02 (2013.01) [B65H 31/36 (2013.01); B65H 2301/4213 (2013.01); B65H 2404/1114 (2013.01); B65H 2404/653 (2013.01); B65H 2405/11151 (2013.01); B65H 2801/27 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A post-processing device comprising:
a mounting section on which a medium before being subjected to post-processing by a post-processing section is to be mounted;
an aligning section that aligns ends of a plurality of media stacked on the mounting section;
a transport section that transports the medium on the mounting section toward the aligning section in a transport direction;
a feeding section that is provided between the transport section and the aligning section and feeds the medium in the transport direction; and
a pressing section that is provided between the transport section and the aligning section, applies, to the medium, a pressing force having a component in a direction opposite from the transport direction, and applies the pressing force to the medium before the feeding section applies a feeding force to the medium; and
a controller configured to control a rotational shaft of the feeding section,
wherein the controller controls the rotational shaft of the feeding section to cause the pressing section to apply the pressing force to a top planar surface of the medium.