US 12,350,932 B2
Die for a printhead
Scott A. Linn, Corvallis, OR (US); James Michael Gardner, Corvallis, OR (US); and Michael W. Cumbie, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on May 25, 2023, as Appl. No. 18/202,217.
Application 18/202,217 is a continuation of application No. 16/766,519, granted, now 11,701,880, previously published as PCT/US2019/016786, filed on Feb. 6, 2019.
Prior Publication US 2023/0302790 A1, Sep. 28, 2023
Int. Cl. B41J 2/045 (2006.01); B41J 2/14 (2006.01); G11C 7/10 (2006.01)
CPC B41J 2/04551 (2013.01) [B41J 2/04541 (2013.01); B41J 2/04543 (2013.01); B41J 2/0458 (2013.01); B41J 2/04581 (2013.01); B41J 2/14072 (2013.01); B41J 2/14201 (2013.01); B41J 2/1433 (2013.01); G11C 7/1072 (2013.01); B41J 2002/14491 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A printhead, comprising a die comprising:
a configuration register;
a status register coupled to the configuration register, the status register to record information including a condition of the die;
a plurality of fluidic actuator arrays;
a memory element associated with each of the plurality of fluidic actuator arrays; and
an interface comprising a data pad, a mode pad, and a clock pad,
wherein a bit value present at the data pad is loaded into a memory element corresponding to a first fluidic actuator array on a rising clock edge and loaded into a memory element corresponding to a second fluidic actuator array on a falling clock edge, and
wherein the status register is read based on the mode pad, and a configuration is loaded from the data pad into the configuration register based on the mode pad.