| CPC B32B 15/08 (2013.01) [B32B 5/16 (2013.01); B32B 15/20 (2013.01); B32B 27/14 (2013.01); B32B 27/283 (2013.01); C03C 17/3639 (2013.01); C03C 17/38 (2013.01); B32B 2250/03 (2013.01); B32B 2250/05 (2013.01); B32B 2250/40 (2013.01); B32B 2264/0214 (2013.01); B32B 2307/416 (2013.01); B32B 2307/732 (2013.01); B32B 2311/12 (2013.01); B32B 2311/24 (2013.01); B32B 2383/00 (2013.01); B32B 2457/00 (2013.01); B32B 2551/00 (2013.01)] | 8 Claims |

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1. A method of forming a metallic film, the method comprising:
disposing a first polymeric layer on a solid substrate, wherein the substrate is glass, metal or silicon, and wherein the first polymeric layer has a thickness in a range of about 0.5 mm to about 1.5 mm;
disposing a first nanoparticle layer on the first polymeric layer, wherein the first nanoparticle layer has a thickness in a range of about 100 nm to about 1.5 μm;
disposing a first metallic layer on the first nanoparticle layer, wherein the first metallic layer has a thickness in a range of about 25 nm to about 125 nm; and
disposing a second polymeric layer on the first metallic layer, wherein the first metallic layer is between the first nanoparticle layer and the second polymeric layer, and wherein the second polymeric layer has a thickness in a range of about 10 μm to about 150 μm.
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