US 12,350,861 B2
Device and method for laminating a substrate with a thermoplastic film
Kai Ethner, Langenfeld (DE); and Hans-Georg Kinzelmann, Pulheim (DE)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Apr. 3, 2023, as Appl. No. 18/194,839.
Application 18/194,839 is a continuation of application No. PCT/EP2021/075766, filed on Sep. 20, 2021.
Claims priority of application No. 20200967 (EP), filed on Oct. 9, 2020.
Prior Publication US 2023/0241807 A1, Aug. 3, 2023
Int. Cl. B29C 31/04 (2006.01); B29C 35/02 (2006.01); B29C 35/16 (2006.01); B29C 53/26 (2006.01); B29K 101/12 (2006.01)
CPC B29C 31/04 (2013.01) [B29C 35/02 (2013.01); B29C 35/16 (2013.01); B29C 53/265 (2013.01); B29C 2791/003 (2013.01); B29K 2101/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device for laminating a substrate with a thermoplastic film, the device comprising:
a laminator configured to laminate the substrate with the thermoplastic film; and
a feeder configured to feed the thermoplastic film to the laminator, the feeder comprising:
a heater arranged adjacent to and configured to heat a first side of the thermoplastic film,
a cooler arranged adjacent to and configured to cool a second side of the thermoplastic film, the second side of the thermoplastic film being opposite the first side of the thermoplastic film, and the cooler opposing the heater along a direction of movement of the thermoplastic film, and a
collector spaced entirely from and under the cooler, the collector configured to collect condensate produced on the cooler.