US 11,056,827 B2
Electronic device and method for identifying state of connection between connector and electrical path
Seunghyun Yeo, Gyeonggi-do (KR); Minyoung Kwon, Gyeonggi-do (KR); Jungmin Lee, Gyeonggi-do (KR); Hyunsu Lee, Gyeonggi-do (KR); and Hyunsuk Choi, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Dec. 13, 2019, as Appl. No. 16/713,444.
Claims priority of application No. 10-2018-0161685 (KR), filed on Dec. 14, 2018.
Prior Publication US 2020/0194928 A1, Jun. 18, 2020
Int. Cl. H01R 13/62 (2006.01); H01R 12/78 (2011.01); H01Q 1/24 (2006.01); H03H 7/38 (2006.01)
CPC H01R 13/62 (2013.01) [H01Q 1/245 (2013.01); H01R 12/78 (2013.01); H03H 7/38 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a housing;
a first printed circuit board (PCB) disposed in the housing and including a first connector and a grip sensor;
a second PCB disposed separate from the first PCB and including a second connector;
an electrical path electrically coupled to the first connector and the second connector;
at least one antenna forming part of the housing or disposed within the housing;
a processor operatively connected to the grip sensor and the at least one antenna;
a first conductive path electrically coupled to the grip sensor and the at least one antenna; and
a second conductive path electrically coupled to the grip sensor and the first connector,
wherein the grip sensor is configured to measure a first capacitance value of the second conductive path and provide the first capacitance value to the processor, and
wherein the processor is configured to: identify a state of a first electrical connection between the first connector and the electrical path, and a state of a second electrical connection between the second connector and the electrical path, based on the first capacitance value.