US 11,056,607 B2
Complex sensing device packaging structure and packaging method
Wen-Chieh Tsou, Hsinchu County (TW); Yi-Hua Chang, Hsinchu County (TW); and Chih-Wei Chen, Hsinchu County (TW)
Assigned to SensorTek technology Corp., Hsinchu County (TW)
Filed by SensorTek technology Corp., Hsinchu County (TW)
Filed on Jul. 16, 2019, as Appl. No. 16/512,406.
Claims priority of provisional application 62/698,292, filed on Jul. 16, 2018.
Prior Publication US 2020/0044112 A1, Feb. 6, 2020
Int. Cl. H01L 31/112 (2006.01); G01S 17/08 (2006.01); H01L 31/0203 (2014.01); H01L 33/54 (2010.01)
CPC H01L 31/112 (2013.01) [G01S 17/08 (2013.01); H01L 31/0203 (2013.01); H01L 33/54 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A complex sensing device packaging structure, comprising:
a light emitting element sealed in a first transparent molding material;
a light sensing element sealed in a second transparent molding material;
a substrate disposed with the light emitting element, the light sensing element, the first transparent molding material and the second transparent molding material; and
an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature;
wherein a solidification temperature of the opaque blocking element is lower than a glass transition temperature of the first transparent molding material and the second transparent molding material.