US 11,056,555 B2
Semiconductor device having 3D inductor and method of manufacturing the same
Cheng-Hung Shih, Changhua County (TW); Nian-Cih Yang, Hsinchu County (TW); Yi-Cheng Chen, Taoyuan (TW); and Shang-Jan Yang, New Taipei (TW)
Assigned to CHIPBOND TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed by CHIPBOND TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed on May 28, 2020, as Appl. No. 16/885,461.
Application 16/885,461 is a division of application No. 16/401,736, filed on May 2, 2019.
Claims priority of application No. 108105447.0 (TW), filed on Feb. 19, 2019.
Prior Publication US 2020/0295123 A1, Sep. 17, 2020
Int. Cl. H01L 29/00 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01)
CPC H01L 28/10 (2013.01) [H01L 23/645 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, comprising:
forming a first transverse inductor on a first substrate, the first substrate includes a first conductive pad and a second conductive pad, the first transverse inductor includes a plurality of first inductor portions which are formed on the first substrate radially and each include a first exterior end and a first interior end, wherein one of the first inductor portions is connected to the first conductive pad and another one of the first inductor portions is connected to the second conductive pad;
forming a second transverse inductor on a second substrate, the second transverse inductor includes an insulation layer and a plurality of second inductor portions, the insulation layer is formed on the second substrate and includes a plurality of openings arranged radially, the second inductor portions are formed in the openings, arranged radially and each include a second exterior end and a second interior end;
forming a longitudinal inductor on the second transverse inductor, the longitudinal inductor includes a supportive layer, a plurality of exterior inductor portions and a plurality of interior inductor portions, the supportive layer is formed on the second transverse inductor and includes a plurality of exterior openings and a plurality of interior openings, the second exterior end and the second interior end of the second inductor portions are exposed by the exterior openings and the interior openings, respectively, the exterior inductor portions are formed in the exterior openings to connect to the second exterior end of the second inductor portions, and the interior inductor portions are formed in the interior openings to connect to the second interior end of the second inductor portions; and
bonding the longitudinal inductor and the first transverse inductor, the exterior inductor portions and the interior inductor portions are connected to the first exterior end and the first interior end of the first inductor portions, respectively, wherein the exterior and interior inductor portions connected to the same second inductor portion are connected to two of the adjacent first inductor portions, respectively.