US 11,056,470 B2
Electronic package and method for fabricating the same
Kong-Toon Ng, Taichung (TW); Hung-Ho Lee, Taichung (TW); Chee-Key Chung, Taichung (TW); Chang-Fu Lin, Taichung (TW); and Chi-Hsin Chiu, Taichung (TW)
Assigned to Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed by Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed on Jul. 16, 2019, as Appl. No. 16/513,124.
Claims priority of application No. 108121501 (TW), filed on Jun. 20, 2019.
Prior Publication US 2020/0402965 A1, Dec. 24, 2020
Int. Cl. H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 21/568 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24153 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/82005 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an encapsulation layer having a first surface and a second surface opposing the first surface;
a first electronic component embedded in the encapsulation layer and having an active surface and an inactive surface opposing the active surface;
a protection film disposed on the active surface of the first electronic component;
a bonding layer embedded in the encapsulation layer and in direct contact with the inactive surface of the first electronic component;
a plurality of conductive bodies disposed in the protection film and bonded and electrically connected to the first electronic component, wherein the protection film is flush with an end surface of the conductive bodies;
a plurality of conductive pillars embedded in the encapsulation layer;
a circuit structure disposed on the first surface of the encapsulation layer and electrically connected to the conductive pillars and the conductive bodies;
a second electronic component disposed on the circuit structure and electrically connected to the circuit structure, wherein the plurality of conductive bodies are located between the first electronic component and the second electronic component; and
an insulation layer formed on the second surface of the encapsulation layer.