US 11,056,464 B2
Packages with metal line crack prevention design
Chen-Hua Yu, Hsinchu (TW); Shin-Puu Jeng, Hsinchu (TW); Der-Chyang Yeh, Hsinchu (TW); Hsien-Wei Chen, Hsinchu (TW); and Jie Chen, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 7, 2018, as Appl. No. 15/914,102.
Application 15/914,102 is a continuation of application No. 14/244,111, filed on Apr. 3, 2014, granted, now 9,929,126.
Prior Publication US 2018/0197839 A1, Jul. 12, 2018
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/50 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0912 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81385 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A package comprising:
a first package comprising:
a device die comprising a topmost surface at a first vertical level and a bottommost surface at a second vertical level;
a through-via extending from the first vertical level to the second vertical level;
an encapsulant encapsulating the device die and the through-via therein;
a plurality of redistribution lines over the device die; and
a plurality of metal pads over and electrically coupling to the plurality of redistribution lines, wherein the plurality of metal pads comprise:
an array comprising a plurality of rows and a plurality of columns of metal pads, wherein each of metal pads in the array comprises a rounded portion and a bird-beak portion joining the rounded portion, wherein the array comprises a corner metal pad closest to a corner of the first package, wherein the corner metal pad is electrically connected to the through-via, and wherein the corner metal pad is a center-facing pad with a bird-beak pointing direction pointing from a center of the rounded portion of the corner metal pad to a tip of the bird-beak portion of the corner metal pad being substantially pointing to a center of the first package, and wherein bird-beak pointing directions of all metal pads in the array are parallel to each other; and
an under-metal-metallurgy (UBM) contacting the rounded portion of the corner metal pad.