US 11,056,459 B2
Chip package structure and method for forming the same
Chih-Hang Tung, Hsinchu (TW); Tung-Liang Shao, Hsinchu (TW); Su-Chun Yang, Hsinchu County (TW); Geng-Ming Chang, Taichung (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 3, 2019, as Appl. No. 16/373,900.
Claims priority of provisional application 62/718,799, filed on Aug. 14, 2018.
Prior Publication US 2020/0058614 A1, Feb. 20, 2020
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80143 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A method for forming a chip package structure, comprising:
partially removing a first redistribution layer to form an alignment trench in the first redistribution layer, wherein the alignment trench surrounds a bonding portion of the first redistribution layer;
forming a liquid layer over the bonding portion;
disposing a chip structure over the liquid layer, wherein the chip structure comprises a semiconductor substrate; and
evaporating the liquid layer, wherein the chip structure is bonded to the bonding portion, and an inner wall of the alignment trench and a sidewall of the semiconductor substrate are substantially level with each other after the liquid layer is evaporated.