US 11,056,435 B2
Semiconductor package with chamfered pads
Cheng-Lin Ho, Kaohsiung (TW); Chung Chieh Chang, Kaohsiung (TW); Ya Fang Chan, Kaohsiung (TW); and Chih-Cheng Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Nov. 16, 2017, as Appl. No. 15/815,351.
Prior Publication US 2019/0148297 A1, May 16, 2019
Int. Cl. H01L 23/535 (2006.01); H01L 21/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/535 (2013.01) [H01L 21/02019 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A substrate for packaging a semiconductor device, comprising:
a dielectric layer having an upper surface;
a first conductive element disposed on the upper surface of the dielectric layer, the first conductive element having a first central axis in a first direction and a second central axis in a second direction, the first conductive element comprising a first chamfer and a second chamfer adjacent to the first chamfer;
a second conductive element disposed on the upper surface of the dielectric layer, the second conductive element having a first central axis in the first direction and a second central axis in the second direction; and
a third conductive element disposed on the upper surface of the dielectric layer, the third conductive element having a first central axis in the first direction and a second central axis in the second direction,
wherein, the first central axes of the first, second, and third conductive elements are substantially parallel to one another and are misaligned from one another in the first direction, wherein the second central axes of the first and second conductive elements are substantially co-linear in the second direction, the second central axis of the third conductive element is substantially parallel to and misaligned from the second central axes of the first and second conductive elements, and wherein the first chamfer and the second chamfer are substantially asymmetric, and
wherein the third conductive element overlaps with the first and second conductive elements in one of the first and second directions.