US 11,056,409 B2
Composite material and a semiconductor container made of the same
Jyun-Yan Jiang, New Taipei (TW); and Ming-Chien Chiu, New Taipei (TW)
Assigned to GUDENG PRECISION INDUSTRIAL CO., LTD., New Taipei (TW)
Filed by GUDENG PRECISION INDUSTRIAL CO., LTD., New Taipei (TW)
Filed on Jan. 30, 2020, as Appl. No. 16/777,853.
Claims priority of application No. 10810364.8 (TW), filed on Jan. 30, 2019.
Prior Publication US 2020/0243407 A1, Jul. 30, 2020
Int. Cl. H01L 23/06 (2006.01); C08L 53/00 (2006.01); G03F 1/66 (2012.01); C08K 3/04 (2006.01)
CPC H01L 23/06 (2013.01) [C08K 3/042 (2017.05); C08L 53/005 (2013.01); G03F 1/66 (2013.01); C08K 2201/011 (2013.01); C08L 2203/20 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor container made of composite material, comprising:
a cycloolefin material is selected from a group consisting of a graphene material doped cycloolefin copolymer (COC) and a graphene material doped cycloolefin polymer (COP);
wherein the graphene material having a weight percent range from 0.6%-8.0%;
wherein the graphene material comprises graphene nanoplatelets, graphene oxide or combination thereof;
wherein the semiconductor container made of composite material is substrate container or reticle container.