US 11,056,376 B2
Removing an organic sacrificial material from a two-dimensional material
Boon Teik Chan, Wilsele (BE); Jean-Francois de Marneffe, Bossut-Gottechain (BE); Daniil Marinov, Saint Petersburg (RU); Han Chung Lin, Heverlee (BE); and Inge Asselberghs, Heverlee (BE)
Assigned to IMEC VZW, Leuven (BE)
Filed by IMEC VZW, Leuven (BE)
Filed on Nov. 5, 2019, as Appl. No. 16/674,953.
Claims priority of application No. 18204338 (EP), filed on Nov. 5, 2018.
Prior Publication US 2020/0144094 A1, May 7, 2020
Int. Cl. H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 29/24 (2006.01); H01L 29/786 (2006.01)
CPC H01L 21/6836 (2013.01) [H01L 21/02568 (2013.01); H01L 21/7806 (2013.01); H01L 29/24 (2013.01); H01L 29/78696 (2013.01); H01L 2221/68363 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for removing an organic sacrificial material from a two-dimensional material, comprising:
providing a target substrate having the two-dimensional material thereon and a layer of the organic sacrificial material over the two-dimensional material, wherein at least a portion of the organic sacrificial material is irreversibly physically adsorbed to the two-dimensional material;
infiltrating the organic sacrificial material with a metal or ceramic material; and
removing the organic sacrificial material.