US 11,056,364 B2
Method for substrate thinning
Yi-Chao Mao, Taoyuan County (TW); Chin-Chuan Chang, Hsinchu County (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 29, 2020, as Appl. No. 16/886,800.
Application 16/886,800 is a continuation of application No. 16/103,933, filed on Aug. 15, 2018, granted, now 10,672,631.
Prior Publication US 2020/0294818 A1, Sep. 17, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/56 (2006.01)
CPC H01L 21/6715 (2013.01) [H01L 21/566 (2013.01); H01L 21/67126 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 24/09 (2013.01); H01L 2224/02371 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A manufacturing method for thinning a substrate, comprising:
disposing a substrate on a carrying surface of a chuck, wherein a first liquid supply unit surrounds the chuck to form a frame of the chuck, and an outlet of the first liquid supply unit is disposed aside the carrying surface of the chuck;
flowing a first liquid from a bottom of the frame to the outlet and discharging to fill a gap between the substrate and the carrying surface of the chuck; and
thinning the substrate during the gap is filled.