US 11,056,274 B2
Thin film type inductor
Jung Hyuk Jung, Suwon-Si (KR); Ki Young Yoo, Suwon-Si (KR); Hye Yeon Cha, Suwon-Si (KR); and Ji Hye Oh, Suwon-Si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si (KR)
Filed on Jul. 31, 2018, as Appl. No. 16/50,808.
Claims priority of application No. 10-2017-0127951 (KR), filed on Sep. 29, 2017.
Prior Publication US 2019/0103215 A1, Apr. 4, 2019
Int. Cl. H01F 27/29 (2006.01); H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 5/04 (2006.01); H01F 27/02 (2006.01); H01F 17/04 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 5/003 (2013.01); H01F 5/04 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 27/022 (2013.01); H01F 27/292 (2013.01); H01F 2017/048 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thin film type inductor comprising:
a body including a support member including a through hole and a via hole spaced apart from the through hole and filled with a conductive material, an internal coil supported by the support member, and a magnetic material encapsulating the support member and the internal coil and filling the through hole; and
first and second external electrodes disposed on an external surface of the body and connected to both end portions of the internal coil, respectively,
wherein the internal coil includes a first coil disposed on an upper surface of the support member and a second coil disposed on a lower surface of the support member, the first and second coils being connected to each other by a via electrode formed by filling the via hole with the conductive material,
each of the first and second coils includes a plurality of coil patterns,
heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction,
a connection coil pattern, among the plurality of coil patterns arranged along the first virtual line, is directly connected to the via electrode, and
wherein heights of at least three of the plurality of coil patterns arranged along the second virtual line increase toward the external surface of the body.