US 11,056,271 B2
Coil pattern and formation method therefor, and chip element having same
In Kil Park, Seongnam-Si (KR); Seung Hun Cho, Siheung-Si (KR); Gyeong Tae Kim, Ansan-Si (KR); Jun Ho Jung, Siheung-Si (KR); and Sang Jun Park, Hwaseong-Si (KR)
Appl. No. 16/77,725
Filed by MODA-INNOCHIPS CO., LTD., Ansan-Si (KR)
PCT Filed Mar. 13, 2017, PCT No. PCT/KR2017/002661
§ 371(c)(1), (2) Date Aug. 13, 2018,
PCT Pub. No. WO2017/160032, PCT Pub. Date Sep. 21, 2017.
Claims priority of application No. 10-2016-0032204 (KR), filed on Mar. 17, 2016.
Prior Publication US 2020/0335254 A1, Oct. 22, 2020
Int. Cl. H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01L 23/64 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01L 23/645 (2013.01); H01F 2027/2809 (2013.01)] 17 Claims
OG exemplary drawing
1. A coil pattern formed on one or more surfaces of a substrate and comprising:
a first plating film formed on the substrate and having a width gradually decreased from a lower surface thereof contacting the substrate toward an upper surface thereof; and
a second plating film formed to cover the first plating film,
wherein the first plating film is formed such that a ratio of a width of the upper surface thereof to a width of the lower surface thereof is approximately 0.2:1 to approximately 0.9:1.