US 11,055,459 B2
Heterogeneous miniaturization platform
Qianwen Chen, Yorktown Heights, NY (US); Li-Wen Hung, Mahopac, NY (US); Wanki Kim, Chappaqua, NY (US); John U. Knickerbocker, Monroe, NY (US); Kenneth P. Rodbell, Sandy Hook, CT (US); and Robert L. Wisnieff, Ridgefield, CT (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 6, 2019, as Appl. No. 16/433,675.
Application 16/433,675 is a division of application No. 15/626,582, filed on Jun. 19, 2017, granted, now 10,380,284.
Application 15/626,582 is a division of application No. 15/333,832, filed on Oct. 25, 2016, granted, now 9,735,077, issued on Aug. 15, 2017.
Prior Publication US 2019/0311082 A1, Oct. 10, 2019
Int. Cl. H01L 25/065 (2006.01); H01L 25/07 (2006.01); G06F 30/331 (2020.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/11 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01); G06F 15/78 (2006.01); G06F 15/80 (2006.01)
CPC G06F 30/331 (2020.01) [G06F 15/7803 (2013.01); G06F 15/7807 (2013.01); G06F 15/7857 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 24/17 (2013.01); H01L 25/065 (2013.01); H01L 25/0655 (2013.01); H01L 25/071 (2013.01); H01L 25/112 (2013.01); H01L 25/115 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); G06F 15/803 (2013.01); H01L 21/568 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/81005 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A heterogeneous electrical device comprising:
a support substrate;
a microprocessor device on a first portion of the support substrate;
a memory device on a second portion of the support substrate;
a field programmable gateway array (FPGA) device on a third portion of the support substrate;
a component device on a fourth portion of the support substrate; and
a package component electrically interconnecting the microprocessor device, memory device and component device, wherein a geometry of the heterogeneous electrical device has a volume of 1 mm3 or less.