US 11,055,457 B1
Pad ring generation for integrated circuits
Han Chen, Cupertino, CA (US); and John Drummond, San Francisco, CA (US)
Assigned to SiFive, Inc., San Mateo, CA (US)
Filed by SiFive, Inc., San Mateo, CA (US)
Filed on Apr. 15, 2020, as Appl. No. 16/849,533.
Int. Cl. G06F 30/327 (2020.01); G06F 9/30 (2018.01); G06F 30/373 (2020.01); G06F 30/343 (2020.01)
CPC G06F 30/327 (2020.01) [G06F 9/30098 (2013.01); G06F 30/343 (2020.01); G06F 30/373 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
accessing a pad ring configuration data structure, wherein the pad ring configuration data structure declares rules for inputs and outputs of an integrated circuit using a scripting language;
based on the pad ring configuration data structure, automatically generating an integrated circuit design data structure that encodes a physical design for the integrated circuit that includes a pad ring with bumps satisfying the rules for inputs and outputs of the integrated circuit and also includes a placeholder for additional logic circuits, wherein the placeholder includes connections to one or more input drivers of the pad ring and to one or more output drivers of the pad ring;
transmitting, storing, or displaying the integrated circuit design data structure; and
based on the integrated design data structure, generating a package design data structure that encodes a design for a package substrate including an interposer that connects to the bumps.