US 11,055,255 B2
Interface connection apparatus and method
Fu-Ching Hsu, Hsinchu (TW); and Chih-Wei Chang, Hsinchu County (TW)
Assigned to REALTEK SEMICONDUCTOR CORPORATION, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Jan. 14, 2020, as Appl. No. 16/741,932.
Claims priority of application No. 108114565 (TW), filed on Apr. 25, 2019; and application No. 108145582 (TW), filed on Dec. 12, 2019.
Prior Publication US 2020/0341936 A1, Oct. 29, 2020
Int. Cl. G06F 13/40 (2006.01); G06F 13/38 (2006.01); G06F 13/42 (2006.01)
CPC G06F 13/4286 (2013.01) [G06F 13/385 (2013.01); G06F 13/4072 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An interface connection apparatus disposed in a first electronic device, comprising:
an analog physical layer circuit configured to receive an analog handshake signal from a second electronic device and generates a digital handshake signal;
a waveform generation circuit configured to determine whether a number of matching time that a pulse parameter of each of pulses included in the digital handshake signal is within a predetermined pulse parameter range reaches a number of predetermine times, and generate a digital output signal when the number of the matching times reaches the number of the predetermine times, in which an output pulse parameter of each of output pulses of the digital output signal is within the predetermined pulse parameter range; and
a media access control circuit configured to determine that the analog handshake signal is valid when the media access control circuit receives the digital output signal to keep performing handshake.