US 11,055,061 B2
Signal transmission method and a circuit structure for heterogeneous platforms
Sa-Chia Ho, Hsinchu County (TW); Hong-Chang Wu, New Taipei (TW); Hsin-Chen Chen, Kaohsiung (TW); and Yi-Hsuan Wu, Hsinchu (TW)
Assigned to REALTEK SEMICONDUCTOR CORP., Hsinchu (TW)
Filed by REALTEK SEMICONDUCTOR CORP., Hsinchu (TW)
Filed on Oct. 10, 2019, as Appl. No. 16/597,924.
Claims priority of application No. 108100858 (TW), filed on Jan. 9, 2019.
Prior Publication US 2020/0218504 A1, Jul. 9, 2020
Int. Cl. G06F 5/06 (2006.01); G06F 9/44 (2018.01); G06F 3/06 (2006.01); G06F 9/46 (2006.01); G06F 13/40 (2006.01); H04B 1/04 (2006.01)
CPC G06F 5/06 (2013.01) [G06F 3/0601 (2013.01); G06F 9/44 (2013.01); G06F 9/46 (2013.01); G06F 13/4027 (2013.01); H04B 1/04 (2013.01); G06F 2003/0692 (2013.01); G06F 2205/062 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A circuit structure for heterogeneous platforms, comprising:
a first platform;
a bridge circuit electrically connected to the first platform; and
a second platform electrically connected to the bridge circuit, and a signal transmission speed of the first platform being different from the second platform thereof;
wherein a signal transmission bandwidth between the bridge circuit and the second platform is adjusted according to the signal transmission speed between the first platform and the bridge circuit to make the signal transmission speed between the bridge and the second platform being equal to the signal transmission speed between the first platform and the bridge circuit.