US 11,054,740 B2
Imprint mold and method for manufacturing the same
Sheng-Ming Huang, Hsin-Chu (TW); Sheng-Kai Lin, Hsin-Chu (TW); Chih-Chiang Chen, Hsin-Chu (TW); Hui-Ku Chang, Hsin-Chu (TW); Chia-Hsin Chung, Hsin-Chu (TW); Wei-Chi Wang, Hsin-Chu (TW); Ming-Jui Wang, Hsin-Chu (TW); Jen-Kuei Lu, Hsin-Chu (TW); Tsai-Sheng Lo, Hsin-Chu (TW); and Huang-Kai Shen, Hsin-Chu (TW)
Assigned to AU OPTRONICS CORPORATION, Hsin-Chu (TW)
Filed by AU OPTRONICS CORPORATION, Hsin-Chu (TW)
Filed on Sep. 10, 2018, as Appl. No. 16/126,396.
Claims priority of application No. 106131277 (TW), filed on Sep. 12, 2017.
Prior Publication US 2019/0079394 A1, Mar. 14, 2019
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/0002 (2013.01) 11 Claims
OG exemplary drawing
 
1. An imprint mold manufacturing method, comprising:
(Step S1000) disposing a first layer on a substrate;
(Step S2000) disposing a first hard mask layer on the first layer, wherein the first hard mask layer includes one or more first hollow area via photolithography;
(Step S3000) forming a first mold pattern on the first layer by imprinting, wherein the region of the first mold pattern completely overlaps the region of the vertical projection of the first hollow area on the first layer;
(Step S4000) removing the first hard mask layer;
(Step S5000) disposing a second hard mask layer on the first layer, wherein the second hard mask layer includes one or more second hollow area via photolithography, wherein the region of the vertical projection of the second hollow area on the first layer is adjacent to the first mold pattern;
(Step S6000) forming a second mold pattern on the first layer by imprinting, wherein the region of the second mold pattern completely overlaps the region of the vertical projection of the second hollow area on the first layer; and
(Step S7000) removing the second hard mask layer.