US 11,054,597 B2
Electro-optical package and method of fabrication
Vivek Raghunathan, Mountain View, CA (US); Vivek Raghuraman, Santa Clara, CA (US); Karlheinz Muth, Richardson, TX (US); David Arlo Nelson, Fort Collins, CO (US); Chia-Te Chou, Pasadena, CA (US); Brett Sawyer, Pasadena, CA (US); and SeungJae Lee, Pasadena, CA (US)
Assigned to Rockley Photonics Limited, Oxford (GB)
Filed by ROCKLEY PHOTONICS LIMITED, London (GB)
Filed on Apr. 11, 2019, as Appl. No. 16/382,076.
Claims priority of provisional application 62/656,757, filed on Apr. 12, 2018.
Claims priority of provisional application 62/829,519, filed on Apr. 4, 2019.
Prior Publication US 2019/0317287 A1, Oct. 17, 2019
Int. Cl. G02B 6/12 (2006.01); G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01)
CPC G02B 6/43 (2013.01) [G02B 6/426 (2013.01); G02B 6/428 (2013.01); H01L 25/167 (2013.01); H05K 1/0274 (2013.01); H05K 3/30 (2013.01); H05K 2201/10378 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system, comprising:
a first electro-optical chip coupled to an array of optical fibers; and
a first physical medium dependent integrated circuit coupled to the first electro-optical chip;
a first optical interposer chip coupled to the array of optical fibers; and
a first redistribution layer between the first physical medium dependent integrated circuit and the first optical interposer chip,
the first electro-optical chip being coupled to the array of optical fibers through the first optical interposer chip,
the first optical interposer chip comprising:
one or more waveguides; and
one or more conductive traces,
the one or more waveguides being on a first surface of the first optical interposer chip,
the one or more conductive traces being on the first surface of the first optical interposer chip,
the first surface of the first optical interposer chip being a surface of the first optical interposer chip facing the first physical medium dependent integrated circuit, and
the first redistribution layer comprising:
a layer of insulating material;
one or more conductive traces; and
one or more vias.