US 11,054,593 B1
Chip-scale optoelectronic transceiver with microspringed interposer
Christopher L. Chua, San Jose, CA (US)
Assigned to Palo Alto Research Center Incorporated, Palo Alto, CA (US)
Filed by Palo Alto Research Center Incorporated, Palo Alto, CA (US)
Filed on Mar. 11, 2020, as Appl. No. 16/815,932.
Int. Cl. G02B 6/42 (2006.01); H04B 10/25 (2013.01); H01L 23/498 (2006.01); H04B 10/40 (2013.01); H01L 31/12 (2006.01)
CPC G02B 6/4278 (2013.01) [G02B 6/423 (2013.01); G02B 6/4246 (2013.01); H01L 23/49811 (2013.01); H01L 31/12 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transceiver comprising:
an interposer comprising:
an interposer substrate; and
first and second microspring electrical contacts disposed on the interposer substrate;
at least one electronic chip comprising:
an electronic chip substrate;
electronic devices disposed in and/or on a surface of the electronic chip substrate, the electronic devices comprising at least one of an amplifier array and a laser driver array; and
first electrical contact pads disposed on the electronic chip substrate, the first electrical contact pads arranged to make electrical contact with the first microsprings of the interposer;
at least one optoelectronic chip, comprising:
an optoelectronic chip substrate;
optoelectronic devices disposed in and/or on the optoelectronic chip substrate, the optoelectronic devices comprising at least one of a laser array and a photodetector array; and
second electrical contact pads disposed on the optoelectronic chip substrate, the second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer,
wherein the transceiver has an area less than or equal to 0.17 mm2 per Gbps.